We offer one-stop service for wire bonding of light-emitting devices from prototype to small-scale production! *Currently providing "High-Density Mounting Specifications" and "Case Studies for Problem Solving."
We propose unique design and implementation know-how using technologies accumulated through various achievements, covering package structures, bonding methods, and material selection.
We support flip chip bonding, including C4 bonding, thermal compression using NCP resin, ultrasonic GGI bonding, and AuAu thermal compression.
Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding.
We also offer contract development services, including substrate procurement.
【Features】
■ Support for module development, prototyping to evaluation, and mass production
■ Proposals based on unique know-how in bonding methods and material selection
■ Support for wire bonding and flip chip bonding
■ Information on other contract development services is also available
*For more details, please refer to the PDF document or feel free to contact us.
![Aluminum Wire Bonding [Contract Design and Manufacturing Case Study]](https://image.mono.ipros.com/public/product/image/f8e/2001288805/IPROS23306490902372353595.jpeg?w=280&h=280)
